Motorola CPCI-6115 Service Manual Page 95
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Chapter 8 Drive Removal and Installation
CPX8216 and CPX8216T Installation and Use (6806800A52C)
75
5. For a SCSI carrier frame, set the carrier frame’s CPU assignment according to the following
information.
When the switch is engaged, the hot swap carrier sends a PRESENT signal to the HSC module.
This setting (A/B) makes the device available to the specific domain’s processor board and
allows the domain’s host processor and HSC module to control the device’s status indicators
and power.
Drive Type Configuration
SCSI Set CPUs using J1 and J2 on the back of
the carrier frame.
CPU A - J1 pins 1 and 2
CPU B - J2 pins 1 and 2
CPUs A and B (default) - J1 pins 1- 2 and
J2 pins 1 - 2.
Notes
1. The SCSI controller resides on a domain’s host
processor board. Configure only for that domain
(CPU A or CPU B)
2. The device is configured to boot domain A or B
3. Only that domain’s processor can control the SCSI
device even if the host processor for the other
domain acquires control of the domain.
4. The SCSI controller must reside on that domain’s
processor and should be configured to belong to
that domain only.
SCSI The SCSI controller resides in a nonhost
system slot and is not configured to boot
the domain.
Notes
1. Configure so that either processor board can gain
access to that device via the HSC.
2. Example: Domain B’s host processor acquires
control of Domain A and the SCSI controller for
Domain A is in one of the nonhost system slots,
the drives attached to that SCSI controller are
available to Domain B’s host processor.
3. Use the default configuration (both A and B).
Note SCSI peripheral devices may be mapped to both domains by setting the jumpers accordingly. This ensures
the SCSI device remains active when a system processor/bridge pair is removed or powered down. If the SCSI
device is only used by one of the system processors, it should be set like an IDE device.
JP7
Q1 Q2
J1
J2
R4
R3
R2
R6R1
R5
JP11
JP2
JP4
2448 9812
J1
J2
J1
J2
J1
J2
CPUs A and B
(Default)
CPU B
CPU A
- CPX8216 and CPX8216T 1
- Trademarks 2
- Contact Address 2
- Safety Summary 3
- Flammability 4
- EMI Caution 4
- FCC Class A 5
- Industrie Canada 5
- WEEE Compliance 5
- Contents 12
- List of Figures 13
- List of Tables 15
- About This Manual 17
- Summary of Changes 18
- Comments and Suggestions 18
- Introduction 21
- Chapter 1 Introduction 22
- System Architecture 23
- Platform Layout 24
- CPX8216 Standard Layout 25
- CPX8216T (H.110) Layout 26
- Bus Access and Control 27
- Hot Swap Controller 28
- The Simplex Configuration 29
- I/O Domain A I/O Domain B 30
- Active CPU Active HSC 30
- I/O Configurations 31
- CPU Complex Architecture 32
- Staged Pins 33
- The Hot Swap Process 34
- Physical 34
- Hardware 34
- Software 34
- Physical Connection Process 35
- Hardware Connection Process 35
- Software Connection Process 35
- Hardware Resources 36
- Device Drivers 36
- Platform Description 37
- Figure 3-2. CPX8216 Rear View 38
- Front Slots 39
- Rear Slots - RTM 39
- PRIMARY SIDE 40
- H. 110 Bus 41
- CompactPCI Bus 41
- System Slot 41
- HSC Slot 41
- Power/Fan Modules 43
- Power Distribution Panel 44
- Drive Modules 46
- Site Preparation 47
- Power Requirements 48
- Power Circuit Protection 49
- Cable Planning 50
- Environmental Considerations 51
- Chapter 4 Site Preparation 52
- Chassis Installation 53
- Mounting Hole Locations 54
- SIDE VIEW FRONT VIEW 56
- TOP VIEW 56
- Warni ng 57
- Rack/Cabinet 59
- Connecting the Chassis Cables 60
- -48 VDC RTN 60
- Connecting a SCSI Cable 61
- Connecting a Serial Console 62
- Chassis Operations 65
- Emergency Power-Off Procedure 66
- Controls and Indicators 66
- Input Power Rocker Switch 67
- Indicators 67
- System Status Indicators 67
- MINOR MAJOR CRITICAL 68
- LED Color 69
- Out of Service Red 69
- In Service Green 69
- Power Supply/Fan Indicators 70
- Keyswitch 71
- Out-of-Service 71
- In-Service 71
- Drive Activity 71
- 2963 0601 72
- Chassis Cooling 73
- 4244 1103 74
- Air Intake 74
- Cooling Monitoring 75
- Power Monitoring 75
- Chapter 6 Chassis Operations 76
- Observe ESD Precautions 77
- Preserve EMI Compliance 78
- Understand Hot Swap 78
- 4243 1103 79
- Installing a Module 80
- Removing a Hot-Swap Module 81
- 4322 0804 82
- MCP750 TMCP700 84
- BACKPLANE 84
- Overview of Carrier Frames 86
- Hot Swap IDE Drives 87
- 4084 0302 89
- 2422 9811 91
- Red Cable Select 4 92
- Ye l l o w S l a v e 3 92
- Green Master 2 92
- 2447 9812 93
- Hot Swap SCSI Drives 94
- 2448 9812 95
- CPUs A and B 95
- (Default) 95
- 2417 9811 96
- 2418 9811 98
- Drive Activity Cable Detail 99
- 4272 0404 100
- 2446 9812 101
- Non-Hot Swap Drive Modules 102
- 2414 9811 103
- Drive Configuration 104
- 2420 9811 106
- Removing a 5.25-inch Drive 107
- 2415 9811 108
- Replacing a Floppy Drive 110
- 2445 9812 111
- Overview 113
- Removal 114
- Installation 115
- Fan Module Replacement 115
- Alarm Panel 116
- Installing the Floppy Housing 118
- Pin Assignments 121
- Chapter 10 Pin Assignments 122
- CPX8216 standard backplane 133
- Transition Module Slots 140
- (Transition Slots 7 and 9) 145
- Remote Alarm Connector (J1) 150
- Drive Connectors 150
- IDE Drive (IDEA and IDEB) 151
- Specifications 153
- Appendix A Specifications 154
- Systeminstallationsanleitung 159
- Kühlen des Gehäuses 160
- ESE und Sicherheit 160
- Anschließen des Systems 162
- Einschalten des Netzstroms 162
- Related Documentation 165
- Related Specifications 166
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